Description

Has been specialized in the development, manufacture and sales of PCB & PCBA for more than 10vears.

 

Our Advantage

3000 square meters production area

20 talented engineers and technicians200 workers

Daily order processing capacity150+

On time delivery rate 95%+

Product qualification rate 98%+

Sample Delivery within 24hours

Technical Service 7*24Hours

 

Our Experience

Has been specialized in development, manufacture and marketing PCB&PCBA for more than 10vears

 

PCB Capabilities

Board Size: Max 650mm x 457 mm Board Thickness: 0.4 mm-3.2 mm Lavers: Up to 12 Lavers

Dia Drill Holes: Min 0.3 mm PTH TOL: 3mil

Gold Plated:Over 10-30 Micro Inches Hole Location TOL DTP:0.1mm

Intemal Laver dearance:Min 0.2 mm

Intermal laver Conductor Width: min 0.1 mm Extemal Laver clearance: Min 0.125 mm

Extemal Laver Conductor Width: Min 0.1 mm Feature Location DTP: 0.15 mm

Base material: FR-4,94vo,CEM-1,CEM-3,94HB(XPC) We accept smallquantity

sampledeliverytimeis5-7daysbatch delivery time is 10days (EX-factory), also single laver and double layer be able to made 1days

Why Use SMT

Electronic products pursue miniaturization, the previously used perforated plug-in components can not be reduced, electronic products function more complete, the use of integrated circuits (ICs) has no perforated components, especially large-scale, highly integrated ICs, have to use surface mount components product batch, production automation, the factory to low cost and high output, produce high-quality products to meet customer needs and strengthen market competitiveness.

 

SMT OEM Processing

The development of electronic components, the development of integrated circuits (ICs), the diversified application of semiconductor materials, the revolution of electronic science and technology is imperative, chasing the international trend.

SMT foundry assembly density is high, electronic products are small in size, light in weight, the volume and weight of SMD components are only about 1/10 of the traditional cartridge components, generally after the use of SMT, the volume of electronic products is reduced by 40% ~ 60%, and the weight is reduced by 60% ~ 80%. Easy to automate and improve productivity. Reduce costs by 30%~50%. Save materials, energy, equipment, manpower, time, etc. Good high frequency characteristics. Electromagnetic and RF interference is reduced. High reliability and strong vibration resistance. Low solder joint defect rate.

SMT chip foundry mainly consists of electronic components, integrated circuit design technology, electronic product circuit design technology, circuit board manufacturing technology, automatic placement equipment design and manufacturing technology, circuit assembly manufacturing process technology, assembly and manufacturing of auxiliary materials used in assembly and manufacturing, development and production technology.

 

 

 

 

 

 

 

http://www.ipcba.com/